![]() In: IEEE/ACM international conference on computer-aided design, San Jose Kahng AB, Xu X, Park C-H, Yao H (2008) Layout decomposition for double patterning lithography. Multiple patterning techniques such as quadruple patterning lithography and beyond usually are. Currently, DPL and TPL are the two most studied multiple patterning techniques for advanced technology nodes . In TPL, a layout is decomposed into three masks which further enhance the printing resolution. For 14/10 nm technology node and beyond, triple patterning lithography (TPL) is one technique to obtain qualified printing results. By using two masks which go through two separate exposures, better printing resolution can be achieved. In DPL, a layout is decomposed into two masks, where each feature in the layout is uniquely assigned to one of the masks. For 32/22 nm technology nodes, double patterning lithography (DPL) is one of the most promising techniques for the industry. As the feature size keeps shrinking, there are increasing difficulties to print circuit patterns using single litho exposure. ![]()
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